| CIM_PackageCooling |
| Often, a cooling device is installed in a package such as a chassis or a rack, not for a specific device, but to assist in the cooling of the package in general. This relationship is described by the CIM_PackageCooling association. |
| NameSpace Path |
| \ROOT\CIMV2 |
| PROPERTY | SMS_REPORT | CIMTYPE | DESCRIPTION |
| Antecedent | | Reference | The cooling device for the package. |
| Dependent | | Reference | The physical package whose environment is cooled. |
| SAMPLE DATA INSTANCE |
   Class does not currently contain data instances
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